本帖最後由 palmtree 於 2023-6-14 03:22 編輯
under rmb 1,000 , 低價入市 
https://www.techpowerup.com/ssd-specs/zhitai-tipro7000-2-tb.d1192
The Zhitai TiPRO7000 is a solid-state drive in the M.2 2280 form factor, launched in 2022. It is available in capacities ranging from 512 GB to 2 TB. This page reports specifications for the 2 TB variant. With the rest of the system, the Zhitai TiPRO7000 interfaces using a PCI-Express 4.0 x4 connection. The SSD controller is the IG5236 (Rainier) from InnoGrit, a DRAM cache chip is available. Zhitai has installed 128-layer TLC NAND flash on the TiPRO7000, the flash chips are made by YMTC. To improve write speeds, a pseudo-SLC cache is used, so bursts of incoming writes are absorbed more quickly. Thanks to support for the fast PCI-Express 4.0 interface, performance is excellent. The TiPRO7000 is rated for sequential read speeds of up to 7,400 MB/s and 6,700 MB/s write; random IO reaches 850K IOPS for read and 1050K for writes.
At its launch, the SSD was priced at 224 USD. The warranty length is set to five years, which is an excellent warranty period. Zhitai guarantees an endurance rating of 1200 TBW, a typical value for consumer SSDs.
Solid-State-Drive
Capacity: 2 TB (2048 GB)
Variants: 512 GB 1 TB 2 TB
Overprovisioning: 140.7 GB / 7.4 %
Production: Active
Released: 2022
Price at Launch: 224 USD
Part Number: Unknown
Market: Consumer
Physical
Form Factor: M.2 2280 (Double-Sided)
Interface: PCIe 4.0 x4
Protocol: NVMe 1.4
Power Draw: Unknown
Controller
Manufacturer: InnoGrit
Name: IG5236 (Rainier)
Architecture: ARM 32-bit Cortex-R5
Foundry: TSMC FinFET
Flash Channels: 8 @ 1,200 MT/s
Frequency: 667 MHz
Core Count: Quad-Core
Process: 12 nm
Chip Enables: 4
Controller Features: DRAM (enabled)
NAND Flash
Manufacturer: YMTC
Name: Xtacking 2.0 (CDT2A)
Type: TLC
Technology: 128-layer
Speed: 1600 MT/s
Capacity: 4 chips @ 4 Tbit
ONFI: 4.0
Topology: Charge Trap
Die Size: 60 mm²
(8.5 Gbit/mm²)
Dies per Chip: 8 dies @ 512 Gbit
Planes per Die: 4
Decks per Die: 2
Word Lines: 141 per NAND String
90.8% Vertical Efficiency
Read Time (tR): 46 µs
Program Time (tProg): 620 µs
Block Erase Time (tBERS): 9.0 ms
Die Read Speed: 1391 MB/s
Die Write Speed: 103 MB/s
Endurance:
(up to) 3000 P/E Cycles
(60000 in SLC Mode)
Page Size: 16 KB
Plane Size: 2304 Blocks
DRAM Cache
Type: DDR4
Capacity: 2048 MB
(2x 1024 MB)
Performance
Sequential Read: 7,400 MB/s
Sequential Write: 6,700 MB/s
Random Read: 850,000 IOPS
Random Write: 1,050,000 IOPS
Endurance: 1200 TBW
Warranty: 5 Years
MTBF: 1.5 Million Hours
Drive Writes Per Day (DWPD): 0.3
SLC Write Cache: Yes
Features
TRIM: Yes
SMART: Yes
Power Loss Protection: No
Encryption:
No
RGB Lighting: No
PS5 Compatible: Yes
Notes
NAND Die
Array Eficiency of over 92%
Xtacking 3.0 introduces back side source connect (BSSC) for memory cell wafer, which leads to simpler process and lower cost
This layout has a 2x 2 Plane layout
It achieves 26µs in read latencies in pSLC Mode, and also 180 µs in tPROG in pSLC Mode.
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發表於 2023-5-31 01:58
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